Technology

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Sr. No. Technical Specification202120222023
1Layer CountSS – 48 LSS – 48 LSS – 52 L
2MaterialCEM-1, CEM-3, FR4, High Tg FR4, Polyimide, Teflon, Aluminum or Special Substrate BoardsCEM-1, CEM-3, FR4, High Tg FR4, Polyimide, Teflon, Aluminum, ITO or Special Substrate BoardsCEM-1, CEM-3, FR4, High Tg FR4, Polyimide, Teflon, Aluminum, ITO
or Special Substrate Boards
3Maximum Board Thickness4.80 mm5.20 mm6.00 mm
4Minimum Board Thickness0.40 mm0.25 mm0.25 mm
5Maximum Board Size600 mm x 700 mm600 mm x 800 mm600 mm x 800 mm
6Minimum Hole Size0.15 mm0.15 mm0.13 mm
7Minimum Hole Size- Blind via0.10 mm0.08 mm0.08 mm
8Minimum Hole Size- Buried via0.15 mm0.15 mm0.13 mm
9Layer CountSS – 48 LSS – 48 LSS – 52 L
10MaterialCEM-1, CEM-3, FR4, High Tg FR4, Polyimide, Teflon, Aluminum or Special Substrate BoardsCEM-1, CEM-3, FR4, High Tg FR4, Polyimide, Teflon, Aluminum, ITO or Special Substrate BoardsCEM-1, CEM-3, FR4, High Tg FR4, Polyimide, Teflon, Aluminum, ITO or Special Substrate Boards
11Maximum Board Thickness4.80 mm5.20 mm6.00 mm
12Minimum Board Thickness0.40 mm0.25 mm0.25 mm
13Maximum Board Size600 mm x 700 mm600 mm x 800 mm600 mm x 800 mm
14Minimum Hole Size0.15 mm0.15 mm0.13 mm
15Minimum Hole Size- Blind via0.10 mm0.08 mm0.08 mm
16Minimum Hole Size- Buried via0.15 mm0.15 mm0.13 mm
17Surface FinishHASL, LF HASL, Immersion Silver, ENIG, Flash Gold, Carbon / Silver Printing, OSP, Immersion Tin etc.HASL, LF HASL, Immersion Silver, ENIG, Flash Gold, Carbon / Silver Printing, OSP, Immersion Tin etc.HASL, LF HASL, Immersion Silver, ENIG, Flash Gold, Carbon / Silver Printing, OSP, Immersion Tin etc.
18Impedance Tolerance+/- 10%+/- 8%+/- 8%
19Etch Tolerance: 0.5 Oz Copper+/- 0.025 mm+/- 0.0175 mm+/- 0.0125 mm
20Etch Tolerance: 2 Oz Copper+/- 0.08 mm+/- 0.05 mm+/- 0.05 mm
21Solder Dam 0.5 Oz Copper0.10 mm0.075 mm0.075 mm
22Solder Dam 1 Oz Copper0.10 mm0.075 mm0.075 mm
23Solder Dam 2 Oz Copper0.15 mm0.10 mm0.10 mm
24Bow and Twist< 0.5%< 0.4%< 0.4%