Technology Roadmap
| Sr. No. | Technical Specification | 2024 | 2025 | 2026 |
|---|---|---|---|---|
| 1 | Layer Count | SS – 48 L | SS – 52 L | SS – 54 L |
| 2 | Material | CEM-1, CEM-3, FR4, High Tg FR4, Polyimide, Teflon, Aluminum, ITO, Copper or Special Substrate Boards | CEM-1, CEM-3, FR4, High Tg FR4, Polyimide, Teflon, Aluminum, ITO, Copper or Special Substrate Boards | CEM-1, CEM-3, FR4, High Tg FR4, Polyimide, Teflon, Aluminum, ITO, Copper or Special Substrate Boards |
| 3 | Maximum Board Thickness | 5.20 mm | 6.00 mm | 6.00 mm |
| 4 | Minimum Board Thickness | 0.25 mm | 0.25 mm | 0.20 mm |
| 5 | Maximum Board Size | 600 mm x 800 mm | 600 mm x 800 mm | 600 mm x 800 mm |
| 6 | Minimum Hole Size | 0.15 mm | 0.13 mm | 0.13 mm |
| 7 | Minimum Hole Size- Blind via | 0.08 mm mm | 0.08 mm | 0.08 mm |
| 8 | Minimum Hole Size- Buried via | 0.15 mm | 0.13 mm | 0.13 mm |
| 9 | Laser Drill | 0.075 mm | 0.075 mm | 0.075 mm |
| 10 | Dielectric Thickness for Laser Drill | 0.10 mm | 0.13 mm | 0.13 mm |
| 11 | Hole Tolerance | +/- 0.05 mm | +/- 0.05 mm | +/- 0.05 mm |
| 12 | Stacked & Micro Via | 0.075 mm | 0.075 mm | 0.075 mm |
| 13 | Aspect Ratio – Through Hole | 12:01 | 12:01 | 13:01 |
| 14 | Outer Layer Copper Thickness | 6.0 Oz | 8.0 Oz | 8.0 Oz |
| 15 | Inner Layer Copper Thickness | 6.0 Oz | 8.0 Oz | 8.0 Oz |
| 16 | Minimum Punching Tolerance | +/- 0.08 mm | +/- 0.08 mm | +/- 0.08 mm |
| 17 | Minimum Line Width | 0.05 mm | 0.05 mm | 0.05 mm |
| 18 | Minimum Inner Core | 0.075 mm | 0.075 mm | 0.075 mm |
| 19 | BGA Minimum Pad Size | 0.15 mm | 0.15 mm | 0.15 mm |
| 20 | Surface Finish | HASL, LF HASL, Immersion Silver, ENIG, Flash Gold, Carbon / Silver Printing, OSP, Immersion Tin etc. | HASL, LF HASL, Immersion Silver, ENIG, Flash Gold, Carbon / Silver Printing, OSP, Immersion Tin etc. | HASL, LF HASL, Immersion Silver, ENIG, Flash Gold, Carbon / Silver Printing, OSP, Immersion Tin etc. |
| 21 | BGA Pitch | 0.40 mm | 0.35 mm | 0.30 mm |
| 22 | SMD Pitch | 0.35 mm | 0.35 mm | 0.30 mm |
| 23 | Impedance Tolerance | +/- 8% | +/- 8% | +/- 8% |
| 24 | Etch Tolerance: 0.5 Oz Copper | +/- 0.0175 mm | +/- 0.0125 mm | +/- 0.0125 mm |
| 25 | Etch Tolerance: 2 Oz Copper | +/- 0.05 mm | +/- 0.05 mm | +/- 0.05 mm |
| 26 | Solder Mask Dam 0.5 Oz Copper | 0.075 mm | 0.075 mm | 0.075 mm |
| 27 | Solder Mask Dam 1 Oz Copper | 0.075 mm | 0.075 mm | 0.075 mm |
| 28 | Solder Mask Dam 2 Oz Copper | 0.13 mm | 0.10 mm | 0.10 mm |
| 29 | Bow and Twist | < 0.4% | < 0.4% | < 0.3% |