Capability | Specification |
---|---|
Layer Count | 4 to 22 Layer |
Thickness Range | 0.5 – 2.4 mm |
Materials | FR4 |
Temperature | From 90 ℃ thru 210 ℃ |
Copper Thickness | 18µm / 35µm / 70µm / 105µm / 140µm |
Copper Plating Holes | 20µm ( 25µm ) |
Min. Line / Spacing | 100µm / 100µm |
Soldermask Color | Green / White / Black / Red / Blue |
Surfaces | HASL, Lead-free HASL, Imm Silver, Imm Gold, Flash Gold, Carbon/Silver Printing, High Temp. OSP, Imm Tin |